Technical Path
2002 Established the first domestic SMD LED packaging lines
2005 Approved high power ceramic led patent, package technology and package product
2006 DA-epoxy ohmic contact bottom line protection technology and patent
2009 TOP LED. Technology improvement of die bounding, Refond was the first to promote the 30mA driven TOP LED
2010 LED TV backlight overall solution and products; High power package phosphor coating technology improvement and lens molding technology
2011 Promoted TOP LED 4014, 7020
2012 High power LED phosphor KL graphical coating; Promoted PCT TOP LED
2013 High power LED eutectic bonding technology MP application
2013 360°emitting package and filament product
2014 CSP patent, technology and product solution; Inorganic package technology and product solution, EMC LED MP
2015 Refond laboratory got CNAS certification
2016 Flip chip on board 3D package technology awarded the first and second prize in national technical inventions.
2017 Micro lens production technology and package application solution
